Clip bonding breakthrough solution

Clip bonding is an alternative process to wire bonding in microelectronics assembly. Clip bonding provides a secure and robust connection, reducing the risk of mechanical failure. It enables fast production rates, as clips can be attached in parallel, improving manufacturing efficiency. Additionally, clip bonding is ideal for power electronics applications, as it can handle high current and voltage requirements. Clip bonding minimizes the risk of wire sweep or damage during handling, making it a reliable choice for demanding electronic devices.