Clip bonding is an alternative process to wire bonding in microelectronics assembly. Clip bonding provides a secure and robust connection, reducing the risk of mechanical failure. It enables fast production rates, as clips can be attached in parallel, improving manufacturing efficiency. Additionally, clip bonding is ideal for power electronics applications, as it can handle high current and voltage requirements. Clip bonding minimizes the risk of wire sweep or damage during handling, making it a reliable choice for demanding electronic devices.
MPP has recently developed a breakthrough solution for increasing the yield and productivity of the clip bonding process by applying innovative flow dynamics concepts to the dispensing tool design that is used in this process. The main advantages of MPPs innovative design are:
MPP’s breakthrough design is already being implemented with leading global power device manufacturers.
