The MPP iBond5000 series integrates the proven MWB mechanical design with an advanced graphic user interface.
iBond5000 main control board is based on Cortex A9 Dual-core CPU that runs at a speed of 1GHz, the operating system is Windows CE based and the system is controlled using a 7” 600X800 TFT touch screen.
The system enables you, the user, to save and load profiles; it comes with factory preconfigured profiles to ease usage
The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade.
| • Ball-wedge bonding capability | |
| • Wire feed angle 90 degrees, vertical feed | |
| Gold Wire Diameter | • Ball bonding and wedge bonding – 0.7 mil to 3.0 mil diameter – 17 micron to 75 micron diameter • Copper Wire – 0.7mil to 2mil -17 micron to 50 micron |
| Spool Size | • Ball bonding 2” x 1” double flange spool |
| Bonding Tool Specification | • Ball bonding capillary lengths – 0.375” – 0.437” – 0.625” |
| Bonding Area | 135 mm x 135 mm (5.3” x 5.3” |
| Throat Depth | 143 mm (5.6”) |
| Gross Table Motion | 140 mm (5.5”) |
| Fine Table Motion | 14 mm (0.55”) |
| Mouse Ratio 6:1 (Choose Mouse Type) | • Left side mouse with right side manual ‘Z’ lever. – Recommend optional ‘Portable Dials Kit’ – Locates critical dials on right side – For operator comfort (Search 1st , Search 2nd , Loop and Tail) – Right side mouse with left side manual ‘Z’ lever – Right side mouse with integrated manual ‘Z’ lever |
| Motorized Y | • Stepback up to 4 mm (160 mil) • Reverse up to 0.25 mm (10 mil) • Kink height up to 0.5 mm (20 mil |
| Z Axis Control | DC Servo with closed loop tachometer feedback |
| Z Axis Travel | • 0.500” (12.5 mm) ‘Z’ travel • Increased travel range • Full range of control with the ‘Z’ motor |
| Ultrasonic System | • High Q 60kHz K&S transducer • Phase Lock Loop self-tuning ultrasonic generator |
Parameters
| Low Ultrasonic Power | 1.3 watts |
| High Ultrasonic Power | 2.5 watts |
| Bond Time (Selectable range) | • 10-100 milliseconds • 10-1000 milliseconds |
| Bond Force (Static force adjust) | • 10-250 grams (requires added weights >80 grams) • No springs • Bond Force Coil Range – • Added 3-80 grams (depends on Force parameter setting) • Separate 1st bond and 2nd bond parameters • No springs |
| Wire Termination | • Programmable tail pull for ball bonding |
| Temperature Controller | • Built-in • Range up to 250 o C, +/- 5 oC |
| Facility Requirements | • Electrical: 100 – 240V, 50 / 60Hz • Dimensions in mm: 680 (27”) W x 700 (27.5”) D x 530 (21”) H • Weight in kg: Shipping: 55 (122 lb), Net: 31 (69 lb) |
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