The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed system. For gold or copper ball bonding, the system features a Patented N-EFO to generate the ball bond, which is mounted on a unique swing arm assembly, providing simplified changeover between bonding modes, including:
The iBond5000 Dual enables ball and wedge wire bonder, which based on the proven 4500 Series (the market leader for nearly a decade), provides the high yield and excellent repeatability needed for every wedge and ball bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.
The MPP iBond5000 series integrates the proven MWB mechanical design with an advanced graphic user interface with semi-automatic and manual operation modes, touch-screen interface, individual bond parameter control, program storage, and the capability to handle a wide range of wire diameters, from 18 to 75-micron diameter wire and up to 250 x 25-micron ribbon.
| • Ball-wedge and wedge-wedge bonding capability | |
| • Wire feed angle 90 degrees | |
| Gold wire diameter | • Ball bonding and wedge bonding – 0.7 mil to 3.0 mil diameter – 17 micron to 75 micron diameter • Copper Wire – 0.7mil to 2mil -17 micron to 50 micron |
| Gold ribbon | • Wedge bonding – Up to 1 x 10 mil – Up to 25 x 250 micron |
| Aluminum wire diameter | • Wedge bonding – 0.7 mil to 3.0 mil diameter – 20 micron to 75 micron diameter |
| Spool size | • Ball bonding 2” x 1” double flange spool • Wedge bonding – 2” x 1” double flange spool – 1/2” spool (type TS-1) – 2” x 1” spool holder for ribbon |
| Bonding tool specification | • Wedge bonding wedge length – 0.750” using 0.828” set up gauge • Ball bonding capillary lengths – 0.625” |
| Bonding Area | 135 mm x 135 mm (5.3” x 5.3”) |
| Throat Depth | 143 mm (5.6”) |
| Gross Table Motion | 140 mm (5.5”) |
| Fine Table Motion | 14 mm (0.55”) |
| Mouse Ratio | • Left side mouse with right side manual ‘Z’ lever. – Recommend optional ‘Portable Dials Kit’ – Locates critical dials on right side – For operator comfort (Search 1st , Search 2nd , Loop and Tail) – Right side mouse with left side manual ‘Z’ lever – Right side mouse with integrated manual ‘Z’ lever |
| Motorized Y | • Step back up to 4 mm (160 mil) • Reverse up to 0.25 mm (10 mil) • Kink height up to 0.5 mm (20 mil |
| Z Axis Travel | • 0.500” (12.5 mm) ‘Z’ travel • Increased travel range • Full range of control with the ‘Z’ motor |
| Ultrasonic System | • High Q 60kHz MPP transducer • Phase Lock Loop self-tuning ultrasonic generator |
Parameters
| Low Ultrasonic Power | 1.3 watts |
| High Ultrasonic Power | 3.0 watts |
| Bond Time (Selectable range) | • 10-100 milliseconds • 10-1000 milliseconds |
| Bond Force (Static force adjust) | • 10-120 grams (requires added weights >80 grams) • No springs • Bond Force Coil Range • Added 3-80 grams (depends on Force parameter setting) • Separate 1st bond and 2nd bond parameters • No springs |
| Wire Termination | • Clamp Tear, adjustable ‘Tear’ parameter and ‘Tail’ parameter • Wire tail feed • Programmable clamp motion for wedge bonding • Programmable tail pull for ball bonding |
| Temperature Controller | • Built-in • Range up to 180°C, +/- 5°C |
| Facility Requirements | • Electrical: 100 – 240V, 50 / 60Hz • Dimensions in mm: 680 (27”) W x 700 (27.5”) D x 530 (21”) H • Weight in kg: Shipping: 55 (122 lb), Net: 31 (69 lb) |
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