The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every wedge bonding application including Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.