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Solder Jet Balling dispensing tools by MPP TOOLS
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Solder Jet Ball Dispensers

Our Solder Jet Ball Dispensers offer advanced solutions for precise solder ball dispensing in semiconductor packaging. With innovative jetting technology, these dispensers enable accurate deposition of solder balls onto semiconductor substrates. Designed for high-speed and high-volume production, they ensure uniform solder ball size and placement, enhancing the reliability of solder connections in semiconductor devices.

Solutions for Applications such as cell phone camera modules, HDD assembly, wafer bumping and more 

Superior materials and specifications ensuring long life and high yields

Tailored designs to support customers’ development roadmaps.

Unmatched Quality and Tool-to-Tool Repeatability 

Compatible with  all SJB/SBJ OEM  brands 

Shortest Lead Times in the Market 

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